Area Array Package Design - Ken Gilleo
-30% koodiga BOOKS
Saadetis 22-28 tööpäeva jooksul
30-päevane tagastamisõigus
This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, Area Array Package Design includes vital information necessary for the design of cutting-edge electronics products.
Kirjeldus
This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, Area Array Package Design includes vital information necessary for the design of cutting-edge electronics products.
Lisateave
| Autor | Ken Gilleo |
|---|---|
| Kirjastaja | McGraw-Hill Education LLC (Professional Pod) |
| Väljalaskeaasta | 2003 |
| Kaanetüüp | Pehme kaanega |
| EAN | 9780071737739 |