Direct Copper Interconnection for Advanced Semiconductor Technology -
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In the "More than Moore" era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging.
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Kirjeldus
In the "More than Moore" era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging.
Lisateave
| Kirjastaja | CRC Press |
|---|---|
| Väljalaskeaasta | 2024 |
| Kaanetüüp | Kõvakaaneline |
| EAN | 9781032528236 |