Tasuta kohaletoimetamine tellimustele üle 29 €
  • check 10+ miljonit raamatut
  • check Uued tooted iga päev
  • check Meid usaldab üle 1 miljoni kliendi
  • check Hea hind ja allahindlused
  • check Tarne üle kogu Euroopa

Flip chip: Semiconductor device, Integrated circuit, Microelectromechanical systems, Solder, Circuit board, Wafer (electronics), Wire bonding -

inglise keel
2026-03-11
117,44 € 195,73 €

-40% koodiga BOOKS

Meie tarnija laos

Saadetis 15-21 tööpäeva jooksul

30-päevane tagastamisõigus

High Quality Content by WIKIPEDIA articles! Flip chip, also known as Controlled Collapse Chip Connection or its acronym, C4, is a method for interconnecting semiconductor devices, such as IC chips and Microelectromechanical systems, to external circuitry with solder bumps that have been deposited onto the chip pads. The solder bumps are deposited on the chip pads on the top side of the wafer during the fina ... Täielik kirjeldus

Võib-olla meeldib sulle ka

Kirjeldus

High Quality Content by WIKIPEDIA articles! Flip chip, also known as Controlled Collapse Chip Connection or its acronym, C4, is a method for interconnecting semiconductor devices, such as IC chips and Microelectromechanical systems, to external circuitry with solder bumps that have been deposited onto the chip pads. The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer processing step. In order to mount the chip to external circuitry (e.g., a circuit board or another chip or wafer), it is flipped over so that its top side faces down, and aligned so that its pads align with matching pads on the external circuit, and then the solder is flowed to complete the interconnect. This is in contrast to wire bonding, in which the chip is mounted upright and wires are used to interconnect the chip pads to external circuitry.

Lisateave

Kirjastaja OmniScriptum
Väljalaskeaasta 2026
Kaanetüüp Pehme kaanega
EAN 9786131703386
Kirjuta oma arvustus
Te vaatate: Flip chip: Semiconductor device, Integrated circuit, Microelectromechanical systems, Solder, Circuit board, Wafer (electronics), Wire bonding
Teie hinnang:

Goodreads'i arvustused

117,44 € 195,73 €