Foldable Flex and Thinned Silicon Multichip Packaging Technology -
-40% koodiga BOOKS
Saadetis 12-18 tööpäeva jooksul
30-päevane tagastamisõigus
Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any o ... Täielik kirjeldus
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Kirjeldus
Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.
Lisateave
| Kirjastaja | Springer New York |
|---|---|
| Series | Emerging Technology in Advanced Packaging |
| Väljalaskeaasta | 2014 |
| Kaanetüüp | Pehme kaanega |
| EAN | 9781461349778 |