MEMS Packaging Technologies and 3D Integration -
-40% koodiga BOOKS
Saadetis 10-16 tööpäeva jooksul
30-päevane tagastamisõigus
This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.
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Kirjeldus
This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.
Lisateave
| Kirjastaja | MDPI AG |
|---|---|
| Väljalaskeaasta | 2022 |
| Kaanetüüp | Kõvakaaneline |
| EAN | 9783036542584 |