Solder Joint Reliability Prediction for Multiple Environments - Andrew E. Perkins,Suresh K. Sitaraman
-40% koodiga BOOKS
Saadetis 17-23 tööpäeva jooksul
30-päevane tagastamisõigus
Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a ... Täielik kirjeldus
Võib-olla meeldib sulle ka
TOP
If Anyone Builds It, Everyone Dies: The Case Against Superintelligent AI
Eliezer Yudkowsky, Nate Soares
-40% koodiga BOOKS
Meie tarnija laos
TOP
Open Circuits: The Inner Beauty of Electronic Components
Eric Schlaepfer, Windell Oskay
-40% koodiga BOOKS
Meie tarnija laos
TOP
Get started with MicroPython on Raspberry Pi Pico: The Official Raspberry Pi Pico Guide
-40% koodiga BOOKS
Meie tarnija laos
TOP
We Are Not Machines: The Fight for the Future of Work
-40% koodiga BOOKS
Meie tarnija laos
TOP
Foundations of Flavor: The Noma Guide to Fermentation: Including Step-By-Step Information on Making and Cooking with: Koji, Kombuchas, Shoyus, Misos, Vinegars, Garums, Lacto-Ferments and black Fruits Vegetables
-40% koodiga BOOKS
Meie tarnija laos
TOP
Nucleo Boards Programming with the STM32CubeIDE: Hands-on in more than 50 projects
-40% koodiga BOOKS
Meie tarnija laos
TOP
Data-Driven Science and Engineering: Machine Learning, Dynamical Systems, and Control
Steven L. Brunton, J. Nathan Kutz
-40% koodiga BOOKS
Meie tarnija laos
TOP
Fundamentals of Aerodynamics ISE
Christopher Cadou, John D. Anderson
-40% koodiga BOOKS
Meie tarnija laos
TOP
Black Holes: The Key to Understanding the Universe
-40% koodiga BOOKS
Meie tarnija laos
TOP
Flowers For Algernon: A Modern Literary Classic
-40% koodiga BOOKS
Meie tarnija laos
TOP
Human Compatible: Artificial Intelligence and the Problem of Control
-40% koodiga BOOKS
Meie tarnija laos
TOP
How To Read Water: Clues & Patterns from Puddles to the Sea
-40% koodiga BOOKS
Meie tarnija laos
TOP
Make: Electronics: Learning by Discovery: A hands-on primer for the new electronics enthusiast
-40% koodiga BOOKS
Meie tarnija laos
TOP
Mastering the Arduino Uno R4: Programming and Projects for the Minima and WiFi
-40% koodiga BOOKS
Meie tarnija laos
TOP
The Idea Factory: Bell Labs and the Great Age of American Innovation
-40% koodiga BOOKS
Meie tarnija laos
Kirjeldus
Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.
Lisateave
| Autor | Andrew E. Perkins, Suresh K. Sitaraman |
|---|---|
| Kirjastaja | Springer US |
| Väljalaskeaasta | 2008 |
| Kaanetüüp | Kõvakaaneline |
| EAN | 9780387793931 |