Raamatud King-Ning Tu
Solder Joint Technology: Materials, Properties, and Reliability
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Elements of Electromigration: Electromigration in 3D IC technology
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Solder Joint Technology: Materials, Properties, and Reliability
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Electronic Packaging Science and Technology
Hung-Ming Chen, Chih Chen, King-Ning Tu
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Elements of Electromigration: Electromigration in 3D IC technology
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Understanding the Reliability Technology Based on Entropy Production, and Other Researches
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